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Adhesives for structural bonding, optical devices, encapsulation and potting
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Resins for potting and encapsulation
For encapsulation you will have choice among various epoxy resins:
- 1 or 2 components epoxy
- Heat curing from 25°C à 150°C ou UV curing
- Viscosities from 3 to 50 Pa.s
- Flexible or rigid
- Good ionic purity
- Low CTE
- Good adhesion on most substrates
Applications: Decoders, Smart cards, Semi-conductors, Hybrid circuits /PCB, Protection of electrical aplliances and electronics components,... |
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To Search on our online database of MSDS and TDS, please register and you will receive your username. |
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Structural and optical adhesives
You can look among our strutural and optical grade adhesive:
- 1 or 2 component epoxy
- Curing from 25°C to 150°C
- Viscosities from 0,1 to 130 Pas
- Semi flexible or rigid
- Optical clear or opaque
- Good resistance to high temperature
- Good adhesion on metals, ceramics, glass and most of plastics
- Low outgassing
- Easy to aplly
Applications: Optical devices,Fiber optics, Bonding ferrite cores and magnets, semiconductor applications,... |
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To Search on our online database of MSDS and TDS, please register and you will receive your username. |
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DATA SHEETS
To search on our online database of MSDS and TDS, please register and you will receive your login.
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